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The Fall Microprocessor Forum 's three-day agenda begins
Monday, October 9 with a day-long presentation of the updated
Low Power Seminar incorporating a tutorial on low power for
mobile processors and cooling techniques for very-high-performance
engines. The seminar will also include a presentation by Cadence
on low power design tools and one by Texas Instruments describing
the application of low power technologies to system-on-chip
design. CoWare will present its approach to create SoCs employing
accelerators for better power reduction. Nextreme Thermal
Solutions will solve the other type of problem: how to cool
hot spots on chips running at high frequencies without dropping
frequency and voltage.
Fall Microprocessor Forum 's conference scheduled to take
place Tuesday and Wednesday, October 10 and 11, will be highlighted
by four keynotes from leader companies in low-power desktop
and server processors, design tools, handheld engines, and
operating systems: ARM, Intel, Cadence, and Microsoft. Harlan
McGhan formerly with Sun, will chair a strong session on server
microprocessors showcasing papers from Fujitsu, IBM, and Sun
Microsystems & Emulex. Tom Halfhill, Senior Analyst with
In-Stat will moderate a session presenting new processor cores,
and he and Max Baron, Principal Analyst and conference content
chairperson, will share a two-part mega-session focusing on
massively parallel processors positioned to take advantage
of the rising costs of SoCs employing sub-90nm process technologies.
The conference will close with a new type of session for Fall Microprocessor Forum : Max Baron will chair a session on Multimedia
at the Hardware- Software Interface. Aimed at chip and system
designers, the session includes informative and educational
papers on the latest chip introductions and the selection
of the software to make them shine.
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